Product
NEMST-Jet2008 series
Atmospheric Plasma Cleaner_RF Jet Type / MW Jet Type
- RF Jet plasma design
- Multiple reaction gases can be used
- Excellent cleaning effect with concentrated plasma energy
- Fast treatment speed
- Gap between nozzle and substrate can be larger
- Can be standalone machine or module integrated with in-line mechanism
- Indirect/Remote plasma design
- Can be suitable for different kinds of materials with various shapes
- Reaction gas: Ar, Ar + O2, and etc
- Low reaction gas consumption and running cost
- Effective Range: Φ 10 mm or smaller
- Treatment Speed: 10 mm/sec~300 mm/sec
- Gap between nozzle and substrate: 5 mm ~ 15 mm
- Plasma On Stabilizing Time: < 0.5 sec
- High plasma stability
- Indirect/Remote Plasma with no ESD
- Can be suitable for different kinds of materials with various shapes
- Advanced Semiconductor Processes: Various semiconductor process applications, Wafer Photoresist Removal (Ashing), 3DIC Packaging, CPO (Co-Packaged Optics), and Hybrid Bonding
- Display & Precision Interconnects: ITO Lead cleaning in LCM
- Surface Modification & Bonding Pre-treatment: Surface cleaning, activation, and modification for various materials and components prior to bonding or coating